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VPX双路***至强高性能服务器模块

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Title: Dual-Processor VPX High-Performance Xeon Server Module

Content:

Dual-Processor VPX High-Performance Xeon Server Module

1 Product Introduction

1.1 Product Overview

This is a dual-Xeon VPX module based on the Intel Xeon Gold series processors, featuring high-speed connectors compliant with the VPX specification. Designed for high-performance, fully ruggedized servers, it integrates 128GB of DDR4 memory using surface-mounted memory chips and provides a rich set of robust I/O interfaces (six channels of SATA 3.0/USB 3.0/Gigabit Ethernet/VGA/RS232). The motherboard features high reliability, full ruggedization, high performance, and abundant interfaces, making it ideal as the core motherboard for reliable, ruggedized hyper-converged computing servers.

The motherboard measures 233.35mm (width) × 270mm (length), with a board thickness ≤2.4mm.

1.2 Product Photograph

Figure 1: Product Photo

1.3 System Block Diagram

Figure 2: System Block Diagram

2 Key Features and Performance

  1. CPU: ≥2 processors, x86 architecture, each with a clock frequency ≥2.2GHz and ≥8 cores;
  2. CPU performance shall be no less than Intel(R) Xeon(R) Gold 5120T;
  3. Memory: ≥128GB, using surface-mounted memory chips, DDR4 or higher;
  4. System storage: Socket for system drive reserved on the back side of the PCB;
  5. RAID: On-board RAID controller chip enabling hardware RAID with support for RAID levels 0, 1, 5, and 10; supports connection of at least six external drives (each up to 2TB capacity);
  6. System: Operating system installed on RAID volume;
  7. VPX interface signals: ≥5 Gigabit Ethernet ports (1000BASE-T), ≥1 VGA video port, ≥3 USB ports (USB 2.0), ≥1 Gigabit management Ethernet port (1000BASE-T), ≥1 RS232 serial data port; Gigabit NICs are surface-mounted;
  8. Front panel signals: 1 VGA standard interface, 2 USB standard interfaces (USB 3.0), 1 BMC and CPU debug serial header, 3 indicator LEDs (power, alarm, and run; alarm LED is red, others are green), and a reset button;
  9. On-board BMC heartbeat LED (green) and CPLD heartbeat LED (green), located on the top side of the PCB for easy debugging and observation;
  10. Graphics: AST2500 implemented as a daughter card using a Samtec Seam8-20-S02.0-L-06-2-K connector, compatible with AST2400 daughter card pinout; signal definitions provided in Appendix 3; graphics resolution supports at least 1920×1200@60Hz;
  11. Power consumption: ≤260W;
  12. Dual VGA outputs operate in mirror mode;
  13. USB ports include over-current protection;
  14. VGA, RS232, Ethernet, and USB interfaces are all ESD-protected and support hot-swap;
  15. AST2500 daughter card used as the BMC management controller;
  16. Supports motherboard hot-swap;
  17. External hard drives support hot-swap;
  18. Capable of connecting to KVM, enabling human-machine interaction for server operation and management via KVM;
  19. Health diagnostics: Capable of reporting status via Simple Network Management Protocol (SNMP) or through network ports; can periodically transmit self-check information to report server status including but not limited to power on/off status, availability, and core parameter data;
  20. Chassis ground and digital ground are isolated.

3 Detailed Specifications and Parameters

3.1 Operating Environment

Specification NameSpecification DescriptionRemarks
Operating Temperature-20°C ~ +55°C
Storage Temperature-40°C ~ +70°C
Relative Humidity95%
Vibration2–100Hz, 1.5G rms (operating);20–2000Hz, 2G rms (non-operating)
Shock20G, 11ms (operating);30G, 11ms (non-operating)

3.2 Electrical Specifications

Specification NameSpecification DescriptionRemarks
Operating Voltage12V/5V standard ATX power supply,supports ATX/AT power-on modes
Typical Power Consumption280WDual CPU + 64GB memory
Cooling MethodAir cooling

3.3 Mechanical Specifications

Specification NameSpecification DescriptionRemarks
Form FactorVPX
Motherboard Dimensions233.35mm × 270mm × 2.4mm

3.4 System Configuration

Specification NameSpecification DescriptionRemarks
ProcessorCPU uses FCLGA3647 socket, compatible with Intel Xeon Gold series processors; planned to use Intel Xeon Gold 5120T, codenamed Skylake-SP, 14nm process, 14 cores, 28 threads, base frequency 2.2GHz, turbo frequency up to 3.2GHz, 19.25MB L3 cache, TDP 105W
ChipsetIntel EY82C621, FCBGA1310 package
MemoryEach processor has 64GB of on-board, 4-channel DDR4 memory (surface-mounted)
Storage1 onboard M.2 NVMe SSD interface
RAID Controller6 SATA 3.0 ports supporting RAID 0, 1, 5, 10
GraphicsAST2500 chip,outputs VGA signal,supports 1920×1080p@60Hz
Operating SystemKylin (Galaxy) operating system

3.5 External Interfaces

Specification NameSpecification DescriptionRemarks
Rear Panel Interfaces1 RS232 interface1 VGA interface3 USB 3.0 interfaces5 Gigabit Ethernet interfaces1 remote management Gigabit Ethernet port
Front Panel Interfaces2 USB 3.0 interfaces1 Power On button1 Reset buttonPin headers reserved for easy front-panel connection
On-board Interfaces
SATA6 onboard SATA 3.0 drive interfaces1 mSATA interfaceSupports hardware RAID 0/1/5/10
Networking5 onboard Gigabit Ethernet pin headersUsable for ruggedized interfaces
Serial1 onboard RS232 pin headerUsable for ruggedized interfaces
Fan Connectors6× 4-pin intelligent fan management headers (2 used by CPUs)
IPMB Interfaces2 IPMB interfacesOutput voltage, current, temperature of key components; support board-level management